Infineon Technologies A.G. is applying a diffusion soldering technique to overcome wire packaging limitations that constrain semiconductor performance and density and add to cost. The Munich, Germany, ...

The 100% lead-free OptiMO T2 power MOSFET from Infineon Technologies is qualified for automotive applications. Based on the company’s thin wafer process technology, the 40-V device is produced using a ...

The document particularly focuses on soldering no-lead brass Many no-lead or lead-free alloys use special chemicals in their composition, making heat diffusion more difficult Today, contractors and ...

Infineon Technologies AG introduced automotive qualified 100 percent lead-free power MOSFETs for TO package types. Infineon Technologies AG introduced automotive qualified 100 percent lead-free power ...

Electronic packaging encapsulates intricate systems whose reliability is critically affected by moisture diffusion and the resultant delamination at material interfaces. As water molecules permeate ...